JPH038572B2 - - Google Patents

Info

Publication number
JPH038572B2
JPH038572B2 JP57110523A JP11052382A JPH038572B2 JP H038572 B2 JPH038572 B2 JP H038572B2 JP 57110523 A JP57110523 A JP 57110523A JP 11052382 A JP11052382 A JP 11052382A JP H038572 B2 JPH038572 B2 JP H038572B2
Authority
JP
Japan
Prior art keywords
oxide
layer
ceramic capacitor
dielectric
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57110523A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59914A (ja
Inventor
Ryo Kimura
Kazuyuki Nonaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57110523A priority Critical patent/JPS59914A/ja
Publication of JPS59914A publication Critical patent/JPS59914A/ja
Publication of JPH038572B2 publication Critical patent/JPH038572B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57110523A 1982-06-25 1982-06-25 積層回路部品の製造方法 Granted JPS59914A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57110523A JPS59914A (ja) 1982-06-25 1982-06-25 積層回路部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57110523A JPS59914A (ja) 1982-06-25 1982-06-25 積層回路部品の製造方法

Publications (2)

Publication Number Publication Date
JPS59914A JPS59914A (ja) 1984-01-06
JPH038572B2 true JPH038572B2 (en]) 1991-02-06

Family

ID=14537953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57110523A Granted JPS59914A (ja) 1982-06-25 1982-06-25 積層回路部品の製造方法

Country Status (1)

Country Link
JP (1) JPS59914A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6790309B1 (ja) * 2020-01-23 2020-11-25 三菱電機株式会社 データ処理装置、データ送信方法及びプログラム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6790309B1 (ja) * 2020-01-23 2020-11-25 三菱電機株式会社 データ処理装置、データ送信方法及びプログラム

Also Published As

Publication number Publication date
JPS59914A (ja) 1984-01-06

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